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Reflowing

Avancé ASIC Repair & Maintenance

Also known as: Reflow soldering, Solder reflow, Reball

Definition

Reflowing (or reflow soldering) involves heating solder joints to their melting point to re-establish electrical connections that have cracked or degraded. This is done using a hot air rework station or infrared heater with precise temperature control. The technique addresses cold solder joints and stress fractures caused by repeated thermal expansion and contraction during normal miner operation.

Reflowing is less invasive than chip replacement and can fix many intermittent failures. However, it is a temporary fix if the root cause (thermal stress) continues. Proper thermal paste application and temperature management help prevent the need for reflowing.

In Simple Terms

Reheating solder joints to fix broken connections. A common repair for intermittent chip failures.

A repair technique that reheats solder joints on a hashboard to restore broken connections. Often fixes intermittent chip failures caused by thermal cycling.

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