Definition
Thermal paste (also called thermal compound or TIM – Thermal Interface Material) fills microscopic imperfections between the chip surface and heatsink, eliminating insulating air pockets. Proper thermal paste application is essential for efficient heat transfer from the ASIC die to the heatsink.
In ASIC repair, replacing dried or degraded thermal paste is a common maintenance procedure that can significantly improve temperatures and allow higher performance. Using quality thermal paste with high thermal conductivity (measured in W/mK) is important for mining hardware that runs 24/7 under heavy load.
In Simple Terms
A compound applied between chips and heatsinks for better heat transfer. Regular replacement improves miner performance.
A thermally conductive compound applied between ASIC chips and heatsinks to eliminate air gaps and improve heat transfer.