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BGA flux paste

$20.00

The BGA Flux Paste is a tacky flux formulated for BGA (Ball Grid Array) rework on ASIC miner hashboards.

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SKU: DC-CONS-FLUX2 Category: Tags: ,

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Description

Bga Flux Paste

The BGA Flux Paste is a tacky flux formulated for BGA (Ball Grid Array) rework on ASIC miner hashboards. It is essential for chip reballing, ASIC chip replacement, and solder reflow operations. When you remove or replace an ASIC chip on a hashboard, flux paste ensures clean solder flow, proper wetting of pads, and reliable joints that will survive thousands of hours of continuous mining operation.

BGA rework without proper flux is a recipe for cold joints, solder bridges, and failed repairs. This paste-type flux holds solder balls in position during reballing, promotes even reflow during hot-air or infrared soldering, and removes oxidation from both the chip pads and the PCB landing pads. It is the same type of flux used by professional repair shops for ASIC chip-level work on Antminer, Whatsminer, and other mining hardware.

Specifications

Specification Value
Type Tacky flux paste for BGA rework
Application BGA reballing, chip replacement, solder reflow
Compatible Work ASIC chip rework on Antminer, Whatsminer, Avalon, Innosilicon hashboards

Use Cases

  • ASIC chip reballing — apply flux to the BGA stencil before placing solder balls. The tacky consistency holds balls in position during reflow.
  • Chip removal — apply around the chip perimeter before heating to promote clean separation and protect surrounding components.
  • Chip re-soldering — apply to PCB pads before placing a new or reballed ASIC chip. Ensures proper wetting and joint formation during reflow.
  • General hashboard solder rework — use for any SMD component replacement, voltage regulator rework, or connector repair on mining PCBs.

Frequently Asked Questions

Do I need flux if I am using solder paste?

No. Solder paste already contains flux. BGA flux paste is used separately when you are working with pre-formed solder balls (reballing) or reflowing existing solder joints. Do not mix flux paste with solder paste — the excess flux can cause voiding and contamination.

Is this suitable for lead-free BGA rework?

Yes. This flux paste works with both leaded (Sn63/Pb37) and lead-free (SAC305) solder alloys used in ASIC miner hashboards. Modern miners predominantly use lead-free solder.

Why Buy from D-Central

D-Central’s repair technicians perform BGA-level rework daily — chip replacements, reballing, and reflow on hashboards from every major manufacturer. We stock the consumables that deliver reliable results under real repair conditions. Ships from Canada with your other repair supplies.

Do I need flux if I am using solder paste?

No. Solder paste already contains flux. BGA flux paste is used separately when you are working with pre-formed solder balls (reballing) or reflowing existing solder joints. Do not mix flux paste with solder paste — the excess flux can cause voiding and contamination.

Is this suitable for lead-free BGA rework?

Yes. This flux paste works with both leaded (Sn63/Pb37) and lead-free (SAC305) solder alloys used in ASIC miner hashboards. Modern miners predominantly use lead-free solder.

Additional information

Weight 20 g
Dimensions 5 × 5 × 5 cm

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