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ASIC Troubleshooting Cheat Sheet — Antminer Bench Diagnostics

Antminer hash board fault diagnosis in four steps: visual inspection → domain voltage sweep → signal chain trace → chip enumeration count. Start unpowered; always probe ground at a PCB test pad, never the heatsink. Every fault maps to one of six root categories in this sheet.

This cheat sheet covers Antminer S9 through S21 XP. All specifications are drawn from verified hardware documentation and reverse-engineering research. For full repair procedures and cost guidance see /asic-repair/, /asic-fault-finder/, and /asic-troubleshooting/.

Symptom → cause triage table

Symptom Severity Most likely cause(s) First check
0 chips detected on all chains CRITICAL Boost circuit dead; crystal (Y1) failed; RST line stuck low; control board no power Measure boost output (see table §4). Check CLK at chip 1 with oscilloscope — expect 25 MHz square wave.
0 chips on one chain only CRITICAL 18-pin ribbon cable; first chip in chain dead (open); LDO on domain 1 failed; level shifter U1 dead Reseat ribbon cable. Measure VDD_BOOST at that board’s boost cap. Probe CI signal at chip 1 input.
Partial chip count (e.g. 53/108) HIGH Dead chip at break point; cold solder on CLK/CO coupling cap across a domain boundary; level shifter failure at that domain Use binary search (dichotomy) method — short RO test point at chain midpoint to VDD. If count increases, fault is in the second half.
All chips detected but low hashrate HIGH Degraded chips (low nonce return rate); domain voltage out of spec; thermal throttling; PLL set too low Read per-chip nonce rate via API or test fixture. Sweep domain voltages — all should be within ±50 mV of each other. Check exhaust temp.
Board draws excessive current, instant fault CRITICAL Shorted ASIC chip; shorted filter capacitor in domain; shorted power MOSFET Unpowered: measure resistance across main power input. Near zero = hard short. Then measure impedance at each domain test point — the outlier is the failed domain.
Intermittent dropouts / random chain resets HIGH BGA cold solder joints (thermal cycling); heatsink detachment (dried thermal paste); temperature sensor false-tripping thermal protection Thermal camera scan under load (heatsink removed, short run). Cold chip among hot neighbors = dead chip. Hot passive = failed LDO or cap.
Board not recognised by control board (EEPROM error) MEDIUM EEPROM data corrupt; EEPROM mismatch (mixed boards from different units); I2C bus fault Read EEPROM (U5 on S19, U10 on S19 Pro, U6 on S21) with CH341A. Compare data against a known-good board from the same serial batch.
Thermal protection trips constantly HIGH Dried/absent thermal paste; heatsink clip failure; temperature sensor IC failure (LM75A / TMP1075 / NCT218) Remove heatsink — check thermal paste coverage. Re-apply Fujipoly SPG-30B or equivalent. If paste is fine, scan I2C at 0x48–0x4F; a frozen sensor returns a fixed absurd value.
PIC error / no 3.3 V output (S19 series only) CRITICAL PIC16F1704 programming corruption; ESD damage to PIC; I2C bus stuck Measure PIC output: U3 pin 2 (S19) or U6 pin 2 (S19 Pro) — expect 3.3 V. If absent, reprogram with PICkit3. Note: S21/T21 have no PIC chip — do not look for one.
Pattern NG (wrong nonce on PT2) MEDIUM Degraded chip transistors; chip characteristic drift; bad solder on BGA pad Run PT3 frequency sweep — chip may pass at lower frequency. If chip fails at minimum rated frequency, it requires replacement.
Fan fault / over-speed alarm HIGH Fan bearing failure; PWM connector damage; fan tach wire open Measure fan connector: 12 V on red, GND on black, PWM on yellow, tach on blue. Replace fan — use OEM-spec RPM. Wrong-RPM fans trigger false alarms.
Stratum connection drops / pool rejected shares MEDIUM PSU output voltage sag under load; clock instability (Y1 aging); firmware misconfiguration This is usually not a hash board fault. Check PSU output under load (APW12: should hold 12–15 V). Verify pool URL, worker credentials, and Stratum version compatibility.

Voltage domain sequence and measurement procedure

ASIC chips are not individually voltage-controlled. They are grouped into voltage domains — clusters sharing a single regulated rail from an LDO (low-dropout regulator) or buck converter. This is a critical diagnostic distinction: a fault reads as an entire domain failing, not a single chip’s voltage changing.

Model-specific domain reference

Model Chip Total chips Domains Chips/domain V/domain Boost output PIC?
S9 / T9+ BM1387 63 21 3 ~0.40 V ~8.4 V Yes (U3)
S19 / T19 / S19a BM1398 76 38 2 ~0.36 V ~19 V Yes — U3 (PIC16F1704)
S19 Pro BM1398 114 38 3 ~0.32 V ~20 V Yes — U6 (PIC16F1704)
S19 XP / S19K Pro BM1366 110 11 10 ~0.40 V ~19 V Yes
S21 / T21 BM1368 108 12 9 ~1.2 V ~25 V (U206) No PIC
S21 XP BM1370 91 13 7 ~1.04 V ~21 V No PIC
Common mistake: Technicians searching for a PIC chip on an S21 or S21 XP board waste significant time. The PIC microcontroller was removed in the BM1368 generation. There is no U3/U6 PIC on S21/T21 hash boards.

Step-by-step domain voltage measurement

  1. Disconnect all power. Wait 30 seconds for capacitor discharge before probing. Large filter caps on boost rails hold dangerous charge.
  2. Anti-static setup. Place board on a grounded anti-static mat. Wear an ESD wrist strap bonded to the mat.
  3. Unpowered domain impedance check. Set multimeter to 200 Ω resistance range. Black probe to PCB ground test pad (not the heatsink — see caution below). Red probe to each domain VDD test point sequentially. Low impedance outlier = domain short circuit.
  4. Power via test fixture. Connect to Bitmain V2.1/V2.3 test fixture or bench supply. Wait 2–5 minutes for stabilization before measuring live voltages.
  5. Live domain voltage sweep. Set multimeter to DC millivolt range. Measure VDD1V2 (1.2 V rail) and VDD0V8 (0.8 V core) at each domain test point. All readings should be within ±50 mV of each other for a healthy board.
  6. Interpret outliers. 100+ mV below average = partial short (failed chip or blown capacitor). Significantly above average = open circuit (broken trace, cracked solder joint, dead LDO in open-circuit failure mode).
  7. Verify boost output. Measure at the output capacitor of the boost converter. Expected voltages are model-specific (see table above). If boost is absent: check the boost MOSFET, inductor, and boost IC.
Critical safety note: The black (ground) multimeter probe must contact a PCB ground test pad, never the heatsink. Contacting the heatsink risks creating a short circuit through the board’s power rails.

LDO structure (S21 / S21 XP)

On BM1368 and BM1370 boards, each domain uses three LDOs:

  • 1× LDO: Boost → 1.2 V (VDDIO / signal level)
  • 2× LDO: 1.2 V → 0.8 V (VDD core)

Domains 11–12 (S21) and 12–13 (S21 XP) are high-voltage domains fed through MP2019 buck converters before the LDO chain. If these specific domains show no output, check the MP2019 (S21: U166/U200; S21 XP: U146/U202) before assuming an LDO failure.

Signal chain reference

Five critical signals on the 18-pin ribbon

Signal Direction S19 voltage S21 voltage Function
CLK Forward (chip 1→N) 0.7–1.3 V 0.58–0.60 V 25 MHz master clock from crystal Y1. All chips daisy-chain this via CLKI → CLKO.
CI / CO Forward (commands in) 0–1.8 V ~1.1 V UART TX. Control board sends 0x55 0xAA preamble + command frames at 115200 baud (8N1).
RI / RO Reverse (responses back) 0.3–1.8 V ~1.1 V UART RX. Nonce responses and register data flow from last chip back to control board.
BI / BO Forward ~0 V (pulse) ~0 V (pulse) Flow-control busy signal. Prevents work overflow during hash computation.
RST Forward 0–1.8 V ~1.2 V Chain reset. Held high during operation. Pulled low during initialization sequence.

Level shifters

The control board operates at 3.3 V logic. ASIC chips use lower signal voltages (1.8 V on S19, ~1.1 V on S21). Level shifters translate these at the board edge and at domain boundaries where voltage changes occur across the chain:

  • S21 (BM1368): 11 level shifters total. Shifters 0–9 powered by domain voltages (~6 V cross-domain differential). Shifters 10–11 powered by U118 (19 V boost LDO).
  • S21 XP (BM1370): 12 level shifters (U1–U12). U1–U9 domain-powered; U10–U11 powered by U24 (19 V boost).
  • S19 series: 2 level shifters at board edge only (3.3 V ↔ 1.8 V). No intra-chain level shifting.

A failed level shifter presents identically to a dead chip at that domain boundary — partial chip count with the break exactly at a domain boundary is a strong indicator of level shifter failure, not a chip failure.

Bench diagnostic sequence — interactive checklist

Check off steps as you work. Progress is saved locally in your browser.

Common Antminer gotchas — things that waste bench time

  1. There is no per-chip voltage control. Voltage is regulated at the domain level — one LDO (or buck converter) per group of 2–10 chips. A multimeter reading “different voltages per chip” is measuring the cumulative voltage drop across serially-wired chips within the domain, not individual chip control. When documentation says a domain voltage is ~0.36 V (S19) or ~1.2 V (S21), that is the regulated supply for the entire group, not a per-chip target.
  2. S21 / T21 have no PIC chip. Bitmain removed the PIC microcontroller starting with the BM1368 generation. The S21 and T21 hash boards do not have U3/U6 PICs. Searching for a PIC on these boards, or expecting a 3.3 V PIC output line, is a diagnostic dead end.
  3. S19 Pro has 114 chips, not 76. The S19 has 76 chips (38 domains × 2 chips). The S19 Pro has 114 chips (38 domains × 3 chips per domain) with a lower per-domain voltage (~0.32 V vs ~0.36 V). Mixing up these counts leads to false “partial chain” diagnoses.
  4. Probing the heatsink as ground will damage the board. The heatsink is not isolated from the board’s copper planes. Connecting a multimeter’s ground probe to the heatsink creates a short-circuit risk across power rails. Always probe a dedicated PCB ground test pad.
  5. A domain-boundary partial count is usually a level shifter, not a dead chip. If chip enumeration breaks exactly at a domain boundary (e.g., 9/12, 18/21), inspect the level shifter at that boundary before replacing any ASIC. Level shifter ICs are considerably cheaper and faster to replace than BGAs.
  6. The CLK crystal is 25 MHz, not a tunable parameter. Y1 is a passive 25 MHz crystal oscillator. The hashing frequency is set via PLL registers inside each chip — the crystal provides only the base reference. A failed crystal (cracked package, cold solder on loading capacitors) produces 0 chips detected, identical to a dead first chip.
  7. Zynq control board CPU runs at 667 MHz, not 700 MHz. The Xilinx Zynq 7010 (XC7Z010) Cortex-A9 cores run at 667 MHz in Antminer control boards. This matters if you are patching firmware timing loops or building third-party control software.
  8. EEPROM data must match across all three hash boards. Hash boards are calibrated as a matched set. Installing a replacement board with different EEPROM data causes the control board to reject it or produce anomalous hashrates. Always read and verify all three EEPROMs before a final assembly test.
  9. S19 XP domain count is 11, not 38. Unlike the S19 / S19 Pro (38 domains), the S19 XP uses BM1366 chips in a different topology: 110 chips across 11 domains (10 chips per domain, ~0.40 V each). Applying S19 domain voltage expectations to an S19 XP leads to wrong fault conclusions.
  10. Repaired boards must run PT1 → PT2 → PT3 in sequence — no skips. PT2 (pattern test) only makes sense after PT1 (chip enumeration) passes. PT3 (frequency sweep) requires the heatsink fully assembled with fresh thermal paste and fans running. Skipping steps results in boards leaving the bench in an untested state.

PSU quick reference

PSU model Output range Max current Compatible miners Key diagnostic note
APW3 / APW3++ 11.6–13.0 V 133 A S7, S9, T9 No I2C voltage control. Fixed via potentiometer. Check trimmer if voltage drifts.
APW9 / APW9+ 14.5–21 V 170–200 A S17, T17 series I2C protocol at 400 Hz (not kHz). PSU slave address 0x10 on /dev/i2c-1.
APW12 (1215) 12–15 V 233 A S19, S19 Pro, T19 Versions a/b/c and d/e/f are NOT interchangeable. d/e/f adds voltage feedback. EN pin: active-low (pull to GND to enable).
APW17 (1215) 12–15 V 267 A S21, S21 Pro, S21 XP Dual AC inputs, each with its own PFC stage. OUT1 = adjustable (hash boards). OUT2 = fixed 12 V (control board + fans).

Frequently asked questions

How do I find which chip is breaking the signal chain without a commercial tester?

Use the binary search (dichotomy) method. When chip enumeration reports fewer chips than expected (e.g., 53 of 108), the chain breaks between the last detected chip and the next one. Short the RO test point at the midpoint of the chain to VDD (the domain voltage at that point). Run enumeration again. If the count increases, the fault is in the second half; if the count stays the same or decreases, the fault is in the first half. Continue halving the search space until you reach a single chip. This technique works because injecting a high signal into the reverse chain at a bypass point simulates a valid nonce response from that position, making all healthy downstream chips visible.

Why does my S21 show a different chip count every time I run PT1?

Intermittent chip enumeration on an S21 typically indicates a BGA cold solder joint on one of the chips near the break point (thermal cycling causes micro-cracks that open and close with temperature). It can also indicate a failing level shifter — S21 boards have 11 level shifters, and a marginal one can pass or fail depending on temperature and supply voltage at the moment of enumeration. Thermal camera imaging under load (heatsink removed for a brief run) usually pinpoints the failing component as a cold spot surrounded by active chips.

Can I use an S19 Pro hash board in an S19 chassis?

The physical form factor and connector are the same, but the EEPROM data and voltage calibration are board-specific. An S19 Pro board (114 chips, 38 domains × 3) in an S19 chassis (expecting 76 chips, 38 domains × 2) will enumerate a partial count and the control board firmware may reject it or apply wrong voltage settings. Mixing is not recommended without EEPROM re-calibration. Always keep matched sets (all three boards with consistent EEPROM data from the same production batch).

What is the first thing to check when the boost voltage is absent?

With the board unpowered, measure resistance between the power MOSFET pins (gate, source, drain — pins 1, 4, 8). A near-zero reading between any two pins indicates a failed MOSFET (shorted in breakdown). If the MOSFET tests clean, check the boost inductor for continuity (an open inductor produces zero boost output), then the boost controller IC for supply voltage. Pre-built replacement boost module boards are available for S19 and S21 series and replace the entire burned circuit including any damaged PCB pads.

How do I tell the difference between a failed LDO and a failed ASIC chip in a domain?

Unpowered, measure impedance at the domain VDD test point versus board ground. Very low impedance (near zero) with no obvious chip damage on visual inspection suggests the LDO output capacitors or the LDO itself is shorted — LDO failures typically produce a hard short that registers before any chip can be assessed. A chip failure is more likely if impedance is normal unpowered but the domain voltage is abnormal under power. When in doubt, remove the LDO (small SMD IC, 4-pin SOT package) and re-measure — if impedance normalises with the LDO removed, the LDO is the fault.

Do I need a Bitmain test fixture, or can I use the miner itself for diagnostics?

The miner’s own control board exposes diagnostic data via its CGMiner/bmminer API on port 4028 and via kernel sysfs paths. You can read chip counts, chain status, and temperature sensor data without any external fixture — useful for triage and initial fault isolation. For PT2 (pattern test) and PT3 (frequency sweep), a Bitmain V2.1/V2.3 test fixture or a third-party tester (such as ARC, STASIC, or K3L/K8) provides more reliable and repeatable results than in-miner testing, and lets you test hash boards independently of a control board.

Go deeper

Disclaimer: This cheat sheet is an educational technical reference for qualified electronics technicians performing bench-level diagnostics. It does not constitute professional repair advice. Working with high-current power supplies and energised PCBs carries serious risks including electric shock, fire, and component damage. Always follow appropriate electrical safety procedures. Specifications cited are drawn from published hardware documentation and open-source reverse-engineering research; always verify against the schematic for your specific board revision before making measurements or component decisions.