ASIC Repair Parts & Common-Failure Components
When an Antminer hash board fails, the fault is almost always one of a small set of component classes. This database maps every replaceable part — ASIC chip, LDO, boost stage, EEPROM, PIC, crystal and more — to its role, how it fails, the diagnostic signal that confirms it, and how hard it is to replace. Need the pin-level wiring behind these parts? See the ASIC power & connector pinout reference.
Quick answer
When an Antminer hash board dies, the fault is almost always one of a small set of component classes — a shorted LDO, a failed boost stage, a cracked ASIC BGA joint, a bad clock crystal, a corrupt EEPROM. This catalog maps each of the 18 replaceable parts on a hash board (and its control-board interface) to its role, package, where it lives, how it fails, the root cause, the exact diagnostic signal to confirm it, and how hard it is to replace — every row cited to the D-Central repair bench reference. It is the component-level companion to our repair-tools and diode-voltage references.
Use it to turn a symptom into a part: read the failure mode and diagnostic-signal columns to localize the fault, then the difficulty column to decide DIY-vs-bench. Two facts worth pinning: (1) the PIC supervisor lives ONLY on S19-generation boards — it was removed on BM1368 (S21/T21) and later, so an S21 has no PIC to blame; (2) anything graded Expert (ASIC BGA reball, PCB trace repair) is microsoldering — send it to a bench. Designators (U-numbers) vary by board revision; confirm against the model schematic. Free CSV/JSON under CC BY 4.0.
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| Component | Common failure mode | Diagnostic signal | Replace difficulty |
|---|---|---|---|
| Mining ASIC chip (BM13xx / BM14xx) Hash board QFN (QFN-34 on BM1397). Generations: BM1387(S9), BM1391(S15), BM1393(S17), BM1397(S17+/e), BM1398(S19/Pro/T19/j), BM1366(S19 XP/K Pro), BM1368(S21/T21), BM1370(S21 Pro/XP/+) Used in: All Antminer hash boards (model-specific chip) | Dead/open chip (chain breaks at chip N); shorted chip (0 chips detected + domain V collapses); low nonce rate (degraded transistors); signal-forwarding fail (cold solder on CO/CLKO/NRSTO); thermal shutdown / BGA solder crack (intermittent dropout) Cause: ESD, thermal runaway/power surge, transistor degradation, thermal cycling/vibration, poor thermal paste | Chip-enumeration count per chain (PT1); domain voltage measurement; per-chip nonce count (PT3 sweep); thermal camera cold-spot for cracked BGA; probe CO/CLKO/NRSTO at chip I/O | Expert Expert (hot-air BGA removal + 0.4mm SAC reball + precise reflow; highest-skill repair) |
| LDO regulator (per-domain low-dropout) Hash board SOT-23 (or 4-pin model-specific); 0.8V (all models), 1.2V (S21/S21 XP), 1.8V (S19 series) Used in: Every Antminer hash board; quantity scales with domain count | LDO short (domain voltage near zero); LDO open (domain voltage high/absent) Cause: Component failure / surge; cracked solder | Multimeter on domain VDD test point: input present but output absent = LDO failure; unpowered domain-impedance check (low=short) | Med-High Medium-High (small SOT-23 hot-air rework; identify correct rail variant) |
| Boost converter module / boost MOSFET Hash board Pre-built boost module PCB OR discrete boost MOSFET + inductor; 18V-class module is a common drop-in part (designators Q9/U206/U146/U202) Used in: S19 and S21 series hash boards (boost output model-specific) | Boost circuit failure -> 0 chips, no domain voltages Cause: Boost MOSFET failure, inductor burn | Measure boost output at output capacitor (S19 ~19V / S19 Pro ~20V C69 / S21 ~25V / S21 XP ~21V); near-zero input resistance = bus short | High Medium (swap pre-built module) to High (discrete MOSFET rework) |
| MP2019 DC-DC buck converter Hash board TSOT-23-8 (designators U166/U200 on S21; U146/U202 on S21 XP) Used in: S21, S21 XP (high domains 11-12 / 12-13) | DC-DC buck failure -> high-voltage domain dead Cause: MP2019 (or similar) component failure | Measure buck output (~2.0-2.5V) at the affected high domain | High High (TSOT-23-8 fine-pitch hot-air rework) |
| Power MOSFET (input power switch) Hash board Multi-pin power MOS (gate=pin1, source=pin4, drain=pin8); exact part per board schematic Used in: Antminer hash boards (power input stage) | Power MOS short -> board draws excessive current Cause: Surge, thermal | Resistance between pins 1,4,8; short between any two pins = MOSFET failure; near-zero input-connector resistance = bus short | Med-High Medium-High (power-package hot-air; large thermal mass) |
| Boost/buck power inductor Hash board Large SMD shielded power inductor (value model-specific; not enumerated in Bible — see uncertainties) Used in: S19/S21 boost (and S21 buck) stages | Inductor burn / open -> boost stage produces no/low output (0 chips, no domain voltages) Cause: Overcurrent from a failed/shorted switching MOSFET; thermal stress | Visual: burnt/discolored inductor; boost output absent at output cap; bus short on input resistance | Medium Medium (large pads, high thermal mass; needs strong hot-air/preheat) |
| Filter / decoupling capacitor Hash board 1uF 0402 16V X5R (decoupling); 22uF 0603 6.3V X5R (LDO filtering); 100nF 0402 (CLK coupling) Used in: All models (large quantity per board) | Filter capacitor short -> domain voltage sags Cause: Capacitor dielectric breakdown | Impedance measurement on the affected domain (sagging V + low impedance) | Medium Medium (small 0402/0603 SMD; identify failed cap among many) |
| Signal-chain resistor Hash board 33 ohm 0603 +/-1% 1/20W (signal chain); 10K 0402 +/-1% 1/16W (pull-up/down) Used in: All models; concentrated at domain boundaries | CLK-resistor cold joint -> chain breaks at domain boundary; CI/BO resistor fault -> chain breaks mid-domain Cause: Cold/cracked solder, manufacturing defect, thermal cycling | Probe CLK before/after the resistor; probe CI/BO at each chip; oscilloscope at the boundary | Medium Medium (tiny 0402/0603; value/placement ID is the hard part) |
| Crystal oscillator (CLK source) Hash board SMD passive crystal, 25 MHz, designator Y1 Used in: All models (Y1 25MHz) | Crystal failure -> 0 chips, no CLK Cause: Cracked crystal, cold solder | Oscilloscope on CLK test point (no/abnormal 25MHz waveform) | Medium Medium (small SMD hot-air; verify oscillation after) |
| Level-shifter IC Hash board Small fine-pitch logic IC (designators U1, U2, ... per model) Used in: S19 (U1,U2) and S21 family (11-12+ units) | Level-shifter failure -> partial chain stops at a domain boundary Cause: IC failure, voltage loss | Signal probe at shifter input vs output (signal present in, absent out) | High High (fine-pitch IC hot-air rework) |
| Temperature sensor IC Hash board LM75A SOIC-8 I2C (S19, L9); TMP1075 SOT-563 I2C (newer); NCT218 (various). S19: U4/U6/U7/U8; S21: U5(inlet)/U7(outlet) Used in: All models (2-4 sensors per board) | Temp sensor failure -> thermal protection trips falsely; I2C bus stuck -> multiple subsystems fail Cause: Sensor IC failure, I2C stuck/SDA-SCL shorted | I2C bus scan + sensor read; oscilloscope on SDA/SCL | Med-High Medium-High (small I2C IC; SOT-563 is very small) |
| EEPROM (board identity memory) Hash board SOIC-8 I2C; S19 U5, S19 Pro U10, S21 U6 (model-specific contents) Used in: All models | EEPROM corruption -> board not recognized; EEPROM mismatch -> mixed boards won't hash Cause: Write failure, I2C bus fault, wrong/cloned data | EEPROM reader/programmer (CH341A); code-editor comparison against a known-good board | Medium Medium hardware swap; data side requires correct dump + reflash (CH341A / hash-board code editor) |
| PIC microcontroller (S19-generation) Hash board PIC16F1704 SOIC-14; S19 U3, S19 Pro U6 Used in: S19 series only (NOT S21/S21 Pro/XP/+ — PIC removed in BM1368) | PIC failure -> 0 chips, no 3.3V output Cause: Programming/firmware corruption, ESD | Measure U3/U6 pin 2 for 3.3V (absent = PIC fault); chain dead at power-up | Medium Medium hardware (SOIC-14) + reprogram with PICkit3 and correct firmware image |
| 18-pin signal cable & board connector Hash board <-> Control board interface 18-pin flat ribbon; board-side connector (pinout: 1 GND, 2 VCC_3V3, 3 RST, 4 SDA, 5 SCL, 7 TX/CI, 8 RX/RO) Used in: All S19/S21 boards | Connector damage / cable fault -> intermittent or no communication with the board Cause: Wear, corrosion, bent pins | Inspect connector pins; signal-probe across the cable; swap with a known-good cable | Low Low (swap ribbon) / Medium (reflow or replace board connector) |
| BGA solder balls (reballing consumable) Hash board (consumable for chip replacement) 0.4mm lead-free Sn/Ag/Cu (SAC) solder balls Used in: BGA reballing on all models | N/A (consumable) — wrong size/alloy or poor reflow -> bridged/open BGA joints, intermittent dropout Cause: Process error during reball | Post-repair: thermal camera + chip enumeration to confirm all joints made | Expert Expert-process (part of the ASIC chip replacement workflow) |
| Thermal interface material Hash board (consumable) Fujipoly SPG-30B (or equivalent high-conductivity TIM) Used in: All models | Dried/insufficient TIM -> thermal shutdown, chip intermittently drops out Cause: Age, heat-cure, prior poor application | Thermal camera hotspot + elevated chip temp read; visual on disassembly | Low Low (clean + reapply during routine maintenance) |
| Heatsink & retention clips Hash board (mechanical) Aluminum heatsink + spring clip (model-specific) Used in: All models | Heatsink detachment -> thermal shutdown Cause: Dried thermal paste, clip failure/loss | Visual + thermal camera (detached/hot region) | Low Low-Medium (mechanical; re-clip + re-paste). CAUTION: never touch black meter probe to the heatsink (short risk) |
| PCB trace / via (board substrate) Hash board (substrate) Multilayer PCB copper (jumper-wire repair where damaged) Used in: All models | Trace damage -> signal chain break or domain open; corrosion from liquid damage Cause: Physical damage, corrosion, delamination | Visual inspection + continuity test; via integrity check under magnification | Expert Expert (microsoldering / jumper-wire trace repair) |
Source: D-Central Mining Bible (HASHBOARD_DIAGNOSTICS) — every row carries a section/line citation in the CSV/JSON. Companion to the repair tools database, the diode & voltage reference and the ASIC chip reference. Need it done? See ASIC repair services.
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Last reviewed June 22, 2026.